Materials

  • FR-1, CEM-1, CEM-3, FR-4, Flex, Rigid Flex, Rogers
  • Thermally Conductive CEM-3 and Aluminum core
  • Up to 10 oz Copper Weight
  • .016 to .157 board thickness



Holes

  • Minimum 0.27 Punched
  • Minimum .008 Drilled
  • Minimum .003 Laser
  • Hole location +/- .003
  • Blind and buried vias
  • Silver or Epoxy Filled Vias


Minimum Line width and spacing

  • .004/.004 Standard
  • .003/.003 Advanced


Soldermask

  • UV Green
  • LPI Green, White, Black & Blue
  • Peelable Masks


Final Finish

  • Lead Free Solder
  • OSP & HT OSP
  • ENIG
  • ENEPIG
  • Carbon Ink
  • HASL


Electrical Test

  • 100% Net List dedicated test
  • Flying Probe Testers



Advance Technologies Available



do you need assistance or have a question?

If you would like to discuss our services, receive a quote, or have any questions, please don't hesitate to contact us.